China's Next-Generation Architecture Strategy in the Semiconductor Sector

Unable to access the most advanced chip manufacturing technologies due to US export controls, China aims to replicate its successful move in the electric vehicle sector within the semiconductor field as well. The country is trying to close this gap with next-generation architectures and alternative scaling laws.

Artificial Intelligence Competition Between the US and China

Artificial intelligence technologies constituted the most important agenda item of the summit held in Washington. While the future of global competition was discussed in the meeting of the two leaders, experts point out that the duration of the US leadership in this field is quite short.

EUV Technology Restrictions and Domestic Solutions

China's biggest deficiency in the semiconductor field is its inability to access the multi-million dollar extreme ultraviolet lithography technology produced by the Dutch company ASML. While the US prevents the sale of these devices, China is trying to carry out domestic production with its own means.

Tau Scaling Law and New Approaches

Wishing to cope with the current restrictions, Chinese manufacturers aim to lead the sector by developing alternative methods. Shown as a potential alternative to Moore's Law, the Tau Scaling Law aims to optimize signal transmission time.

3D Designs and Photonics Technologies

While heavy investments are made in light-based innovations and photonic systems, Huawei and other Chinese companies are commercially implementing innovative architectures such as 3D chip designs and wafer-to-wafer hybrid bonding.